FOUP Automatic Unpacking Machine
Basic functions
According to customer requirements, this equipment unpacks single-layer or double-layer bags of packed wafer carriers (FOUP, FOSB), and reads and verifies material information simultaneously. It replaces manual operations, reduces unpacking errors, avoids workplace safety hazards, stabilizes product quality, and effectively lowers the risk of wafer breakage caused by manual handling to meet automation requirements of smart production lines.
Product Features
Customizable single-layer or double-layer unpacking
Barcode / RFID material data verification
Recyclable desiccant packs
Non-stop refilling
Traceable process records
Compatible with OHT & AGV
Compatible with separator
Product Applications
Semiconductor wafer fabrication, packaging and testing industries
Key Specifications
UPH ≥ 35
MCBI ≥ 2000
Compatible wafer carriers: FOUP / FOSB (12″), Reel / Jedec Tray / HWS / POD (8″)
Compatible packaging bags: aluminum bags, antistatic bags, transparent bags
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